At the Huawei Full Connect Conference, Huawei unveiled revisions to its Ascend series chip launch roadmap. The Ascend 960DT is now slated for release in the first quarter of 2027, a notable nine-month acceleration from its original timeline. Meanwhile, the 960PR is scheduled to debut in the third quarter of the same year. Furthermore, the 970 and 980 chips are projected to hit the market in 2028 and 2029, respectively. A key highlight is the substantial performance enhancement of the 960DT and 960PR, with their capabilities set to double. Presently, the Ascend 950 super node has attained large-scale commercial deployment, boasting over 1,000 units in operation. Additionally, the Atlas 950 SuperPoD is progressing ahead of schedule. Huawei's AI strategy continues to prioritize the monetization of computing power and hardware, fostering hardware adaptation through open-source software services. It integrates diverse domains such as the Pangu large model, cloud services, terminal devices, automotive solutions, and networking into the demand ecosystem, deeply embedding large models into its product offerings. Market research indicates that, in the 2025 Chinese AI accelerator card market, Huawei leads domestic vendors in shipment volume, with domestic players collectively capturing 41% of the market share. Huawei is bridging single-chip gaps via its 'super node + cluster' approach, striving to emulate tech giants like NVIDIA by focusing on connectivity and computing to ensure seamless operation of various large models on its computing platforms.