Two Departments Join Forces to Advance Unified Protocol Series for Computing High-Speed Interconnect Bus (CLink)
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Author:小编   

On September 15, the Ministry of Industry and Information Technology, in collaboration with the National Development and Reform Commission, unveiled the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry.' This strategic plan underscores the imperative to bolster the hardware infrastructure essential for artificial intelligence (AI), championing technological innovation and product enhancements. It highlights the importance of fostering the synergistic development of AI chips and comprehensive systems, expediting the research and development of cloud-based training infrastructure, and pioneering edge inference devices and specialized chips tailored for cutting-edge domains like embodied AI and autonomous driving, thereby broadening the horizons for AI chip applications.

Simultaneously, the plan advocates for the creation and execution of a unified protocol framework for the Computing High-Speed Interconnect Bus (CLink), ensuring seamless interoperability between AI chips and large-scale models, databases, and beyond. Moreover, it proposes the establishment of public service platforms and the refinement of the standard system governing AI chips. At the product development frontier, the plan aims to continually propel the evolution of AI-integrated smartphones, personal computers, smart glasses, audio-visual terminals, in-vehicle systems, as well as industrial and commercial terminals, thereby diversifying application scenarios and elevating user experiences. It also places a strong emphasis on intensifying research and development efforts in key edge technologies and accelerating the conversion and deployment of innovative breakthroughs.