On June 30, Agnes Ng, a portfolio expert at T. Rowe Price Group, stated in a report that the next phase of AI investment opportunities may focus further up the supply chain, rather than on popular AI platforms or chip manufacturers. She believes that areas such as advanced packaging, semiconductor substrates, and high-end printed circuit boards (PCBs) are becoming increasingly critical. Although these components account for a small proportion of the total AI bill of materials, they may become key bottlenecks. She also pointed out that even a small price increase for these products can significantly boost manufacturers' profits while remaining affordable for end customers.
