Two senior Apple executives have disclosed the company's bespoke heat dissipation solutions, tailored specifically for the forthcoming iPhone 18 Pro series and the innovative iPhone Duo. These solutions are meticulously designed to optimize the sustained performance of the cutting-edge A20 Pro chip. The A20 Pro chip leverages a wafer-level multi-chip module packaging strategy, strategically positioning the DRAM in close proximity to the processor. This arrangement facilitates a direct thermal pathway from the chip to the vapor chamber, effectively tackling the heat dissipation challenges inherent in stacked packaging designs.

The vapor chamber within the iPhone 18 Pro series boasts a surface area three times larger than its predecessor, housing an increased volume of deionized water. Not only does it function as an efficient heat dissipater, but it also serves as a robust mechanical framework, constructed from 80% recycled stainless steel, underscoring Apple's commitment to sustainability.

Furthermore, the back of the screen incorporates a nano-twinned copper metal plate and a high-thermal-conductivity graphite layer, stacked to enhance lateral heat dissipation while ensuring the screen's structural integrity.

The iPhone Duo, on the other hand, features a thinner suspended vapor chamber, ingeniously connecting the heat dissipation structures on both sides through flexible graphite tubes integrated within the hinge. This novel approach ensures efficient heat management in a foldable form factor.

The newly introduced heat dissipation system is engineered to support high-load tasks, including gaming, video recording, and on-device AI processing. Notably, the iPhone 18 Pro's sustained GPU performance has witnessed a remarkable 35% increase compared to the previous generation. Meanwhile, the A20 Pro's CPU performance has improved by 20%, and its graphics performance has been enhanced by 40%, setting a new benchmark for mobile device performance.