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Digital repair blogger Yang Changshun live-streamed the disassembly of the new iPhone 18 Pro on the first day of its sale, showcasing its internal materials and structure. He also attempted to upgrade the 256GB version to 1TB but failed to bypass Apple's full-chain hardware encryption verification mechanism. The disassembly revealed that the VC vapor chamber area in the iPhone 18 Pro has been significantly increased, and the A20 Pro chip adopts, for the first time, a separate packaging design for the CPU and RAM. However, the actual AnTuTu benchmark score was less than 3.4 million, lower than that of the Xiaomi Xuanjie O3 chip in the Android camp. Additionally, Yang Changshun pointed out that the variable aperture mechanism of the new phone's camera did not operate smoothly, and the screen of the prototype he disassembled had dead pixels.
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