Two Departments Collaborate: Pioneering Mainboard Architecture Design & High-Density PCB Integration Tech
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Author:小编   

On September 15, the Ministry of Industry and Information Technology, in conjunction with the National Development and Reform Commission, unveiled the '15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry'. This strategic blueprint underscores the importance of innovation in pivotal consumer electronics sectors. Specifically, for high-end smartphones, the plan aims to achieve significant advancements in core technologies, including essential chips and premium display components, while also championing the research and development of products with novel form factors and fostering differentiated competition. In the realm of personal computers, the focus is on breakthroughs in high-performance chips, the evolution of mainboard architecture design, and the advancement of high-density integration technology for printed circuit boards (PCBs). Additionally, there is an emphasis on bolstering the implementation of cutting-edge technologies like flexible displays and advanced packaging to expedite innovation in product form factors. Regarding virtual reality, the plan prioritizes key technologies such as near-eye displays and multimodal perceptual interaction, along with the development of low-power dedicated chips, to broaden the spectrum of terminal products with diverse form factors. For wearable devices, the objective is to secure breakthroughs in crucial technologies like low-power processors, cultivate lightweight operating systems, and diversify the product offerings, including watches and wristbands, in various form factors.