Search
Topsil Semiconductor Equipment (688072.SH): Chip-to-Wafer Hybrid Bonding Equipment Successfully Deployed for Customer Verification
1 day ago /
Read about 0 minute
Author：小编
Topsil Semiconductor Equipment has developed a suite of advanced tools, including PECVD, ALD, and Gapfill thin film deposition equipment, as well as chip-to-wafer hybrid bonding equipment, tailored for the production of high-bandwidth memory chips (HBM). These thin film deposition systems have already seen extensive application in the manufacturing of both memory and logic chips. Notably, the hybrid bonding equipment has successfully completed client verification and has been dispatched for on-site deployment.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
