NVIDIA has expedited the production timeline for the B300 chip to May, a strategic move viewed by the industry as a proactive effort to bridge the production capacity gap created by the ban on the H20 chip. According to reliable supply chain sources, the B300 chip will leverage TSMC's advanced 5nm process and CoWoS-L packaging technology, adhering to the Bianca architecture. This initiative is anticipated to streamline the learning curve for component and ODM contract manufacturing, ultimately facilitating the rapid mass production of GB300 chips by the year's end.
