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Moore Threads Patents 'Innovative Semiconductor Packaging Structure and Manufacturing Technique'
2025-04-24 /
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Author：小编
Moore Threads Intelligent Technology (Beijing) Co., Ltd. has officially published a patent titled 'Semiconductor Packaging Structure and Its Manufacturing Method' under application publication number CN119581432A, dated March 7, 2025. This groundbreaking patent introduces a novel semiconductor packaging structure, which incorporates a substrate and an embedded capacitive component. By integrating the capacitive component within a cavity of the substrate, the design not only minimizes the substrate's thickness but also effectively mitigates warping issues, thereby aligning with the requirements of large-scale packaging applications.
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