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Shenzhen Microwave Technology Unveils Patent for Advanced 'Packaging Method and Filter for Duplex SAW Filters'
2025-01-22 /
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Author：小编
Shenzhen Microwave Technology Co., Ltd. has recently announced a patent with the publication number CN119093903A, titled 'Packaging Method and Filter for a Duplex SAW Filter'. This patent aims to tackle the prevalent open-circuit issue during the packaging process of duplex surface acoustic wave (SAW) filters by innovatively separating the receive (RX) and transmit (TX) chips and packaging them adjacently. This approach is designed to significantly enhance the reliability and overall performance of the product. Duplex SAW filters are indispensable in wireless communication applications, and this groundbreaking technological advancement is poised to usher in new possibilities and opportunities within the industry.
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