On October 29, during its earnings briefing for the third quarter of 2026, Hongban Technology announced that AI server PCBs and high-speed, multi-layer boards stand as pivotal areas for expansion. Currently, the AI server PCBs are still in the customer verification phase. The company is poised to capitalize on opportunities within AI computing power, optical modules, and other domains to propel the volume growth of high-end products. At present, its production capacity is operating at full tilt.
