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AI chip demand squeezes advanced packaging capacity, TSMC's CoWoS reportedly raising prices by up to 20%
9 hour ago /
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Author：小编
Taiwanese media, citing supply chain sources, stated that due to the surge in AI demand and tight capacity in the semiconductor supply chain, TSMC is considering raising quotes for its CoWoS advanced packaging by 10% to 20%. Wafer foundries and packaging/testing firms are also evaluating similar price adjustments. Currently, demand for CoWoS packaging has expanded from GPUs to CPUs and custom ASICs. The prolonged AI chip testing cycles have further intensified capacity pressures, with equipment lead times extending to 6-8 months. TSMC's monthly CoWoS capacity is expected to exceed 130,000 wafers by 2026 and reach 200,000 wafers by 2027.
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