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On October 28th, reports emerged indicating that recent brokerage research suggests a potential shift in Copper Clad Laminate (CCL) and Printed Circuit Board (PCB) manufacturing towards reduced or eliminated fabric usage. This transition could lead to a decrease in the amount of fabric employed in the future supply chain. In response to these findings, several listed companies specializing in electronic fabrics have weighed in, noting that electronic fabric currently constitutes approximately 20% of the total cost of CCL. They also highlighted its advantages, including superior support strength, extended service life, ease of drilling, and resistance to heat deformation. The move towards reducing or eliminating fabric is primarily motivated by cost-saving considerations and will ultimately hinge on the specific needs and circumstances of downstream enterprises.
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