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According to the research report from CITIC Securities, ABF package substrates, a crucial sector within the PCB industry that is continually reaping the benefits of AI advancements, are now enjoying substantial advantages from the widespread adoption of PCB interposers. This trend is poised to drive rapid growth in both market size and profitability. CITIC Securities predicts that, in the near term, the industry's capacity shortage will keep expanding, likely sustaining the upward trajectory of prices. Furthermore, from the viewpoints of domestic board manufacturers and their clientele, the present moment marks a pivotal stage for the full-scale promotion of domestic ABF interposers. CITIC Securities maintains an optimistic outlook on the future performance adaptability of domestic manufacturers.
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