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IBM and Siemens Collaborate to Advance NanoStack, Exploring the Transition of Transistors from 2D Scaling to 3D Stacking
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Author：小编
IBM and Siemens have announced a joint research initiative to advance the NanoStack transistor architecture unveiled by IBM this year, focusing on the development of next-generation chip design, simulation, and manufacturing tools and processes. IBM will provide technical support for semiconductor devices, while Siemens will contribute its capabilities in electronic design automation, process simulation, lithography optimization, and advanced manufacturing software. The two parties plan to build detailed virtual models to simulate performance, optimize designs, and predict manufacturing challenges before chip fabrication.
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