Suanmiao Technology has successfully wrapped up a Series A financing round, securing hundreds of millions of yuan. This round was spearheaded by E-Town Capital. The company is dedicated to the research, development, and large-scale production of high-performance AI cloud chips that feature a 3D architecture. It stands at the forefront by pioneering the 3D TokenPU architecture, which is designed to boost energy efficiency in scenarios involving large model inference.

In June 2026, Suanmiao Technology's first-generation product, the A4E, is set to officially tape out. By leveraging 3D hybrid bonding technology, this product will attain an ultra-high memory access bandwidth of 16TB/s, effectively overcoming the memory constraints that have long hindered large model inference.

The capital raised in this financing round will be strategically allocated to expand the R&D team, propel core technology updates, and expedite the mass production process of the 3D TokenPU chip.