On October 14, during the Opening Ceremony of the 2026 Bay Area Chip Expo and the Semiconductor Industry Development Summit, Cong Hai, the Senior Vice President of AMEC, disclosed that AMEC currently prides itself on its portfolio of 54 series of high-end equipment products. Notably, the company has successfully streamlined its R&D cycles, reducing them from the traditional 3-5 years to under 2 years, and has demonstrated the capability to develop over 20 new devices each year. Looking ahead, Cong Hai announced that AMEC has ambitious plans to cumulatively develop 102 new devices over the next 3 to 5 years, with the total R&D investment anticipated to come close to RMB 13 billion. These forthcoming devices will cater to the high-end equipment needs essential for both front-end and back-end advanced packaging in the realm of integrated circuits, as well as the broader pan-semiconductor sector. Furthermore, Cong Hai emphasized that in the next five to ten years, AMEC is committed to collaborating closely with its partners to strive for a market share that covers 60% of the high-end equipment segment within the integrated circuits industry.