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MemSilicon Successfully Completes Tape-Out of Its Pioneering High-Density, Large-Capacity 1T4R 1Gb RRAM Chip and Proceeds with Verification
19 hour ago /
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Author：小编
On October 12, 2026, MemSilicon made a groundbreaking announcement: it had finalized the tape-out process for the world's inaugural high-density, large-capacity 1T4R 1Gb RRAM chip, dubbed "MountTai 2026." This cutting-edge chip is fabricated on a 28nm CMOS process platform, boasting a remarkable single-chip capacity of 1Gb and an impressive density of 30Mb/mm². Notably, it exhibits an access latency of under 20ns and incorporates on-chip hardware error correction circuitry. This achievement marks a significant synergistic advancement in the realms of large capacity, high density, and rapid reading capabilities, aligning with industry expectations and technological trends.
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