The Signing and Launch of JCET's High-End Advanced Packaging and Testing Project in Wuxi - Chip

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The Signing and Launch of JCET's High-End Advanced Packaging and Testing Project in Wuxi

1 day ago / Read about 0 minute

Author：小编

On September 30th, it was reported that JCET's high-end advanced packaging and testing project had been formally signed in Wuxi on the preceding day, September 29th. This project is centered on the research, development, and industrial application of 2.5D advanced packaging technology for silicon interposers. It is strategically positioned to cater to high-value-added markets, including artificial intelligence and high-performance computing, which are rapidly evolving sectors with immense growth potential.

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