Doshin has unveiled a detailed log of its investor relations activities, revealing that the research and development (R&D) endeavor for its memory-computing-communication integrated chip is projected to last approximately 42 months and is currently advancing steadily as planned. Leveraging cutting-edge packaging technology, the project aims to seamlessly integrate memory, connectivity, and computing components onto a singular chip, with the vision of crafting a low-power embedded intelligent computing chip. This innovative chip will boast capabilities such as localized intelligent processing, robust data privacy and security measures, minimal latency, and exceptional energy efficiency. The development of this chip will be undertaken by Doshin's dedicated in-house team. Given that chip development encompasses multiple intricate stages and is susceptible to various uncertainties, the company will provide updates on specific progress as it unfolds.