A patent application submitted by Intel in 2022, which has only recently been disclosed to the public, unveils a technical approach that suggests embedding Micro LEDs directly within the core of chip packages. This method introduces a structural breakthrough by utilizing a glass substrate and Through-Glass Vias (TGVs): the semiconductor die and Micro LEDs are co-integrated into the glass substrate, where TGVs facilitate the vertical transfer of power and signals. The circuitry is then linked to the motherboard through the package substrate. Micro LEDs can be interconnected through either direct bonding or nanowire techniques, enabling the emission of red, green, and blue light. They can function as decorative elements on devices, offering dynamic lighting effects, serve as status indicators, or even allow for the display of personalized text or logos on the CPU's surface. This packaging architecture combines two layers of silicon nitride material with a glass substrate, boosting interconnect density by roughly ten times compared to conventional organic substrates, thus accommodating intricate chip designs. At present, this technology is still in the patent phase and has not yet been commercialized for mass production.