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On September 30, information from the 'China Optics Valley' WeChat official account revealed that on September 28, the wafer fabrication facility of XianDao Xinguang Optoelectronic Technology (Wuhan) Co., Ltd., a subsidiary of Lead Tech Group, officially began operations in the East Lake Comprehensive Bonded Zone. This facility stands as the cornerstone of the high-end compound semiconductor material and chip industrialization base, backed by a substantial 12 billion yuan investment from Lead Tech Group. It boasts a cutting-edge large-size optoelectronic chip platform that utilizes dual materials: 4/6-inch indium phosphide and 6/8-inch gallium arsenide. Following the commencement of operations, the base will transition into the crucial phase of process certification and product introduction.
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