On November 22, 2023, Resonac (previously known as Showa Denko), a Japanese manufacturer specializing in semiconductor materials, made an announcement. It revealed its intention to set up a cutting-edge research and development center focused on semiconductor packaging and materials in Silicon Valley, USA. Operations at this center are scheduled to kick off in 2025. On that very same day, Resonac also declared its membership in the 'Texas Electronics Institute' (TIE). TIE is an alliance of semiconductor manufacturers based in Texas, USA, and boasts membership from industry giants like AMD, Micron Technology, and Intel. Moreover, Resonac has forged the 'US-JOINT' alliance in collaboration with 10 Japanese and American companies. The aim of this alliance is to collectively advance semiconductor post-process technologies. To further expedite development, Resonac has established a base in Silicon Valley. As of now, there is no publicly available information suggesting that Nitto Denko and Sojitz have officially consented to invest in the second hard-tech fund managed by Silicon Valley venture capital firm Matter Venture Partners.