In April 2022, the Japan Advanced Semiconductor Manufacturing, Inc. (JASM), a collaborative venture involving TSMC, Sony, Denso, and Toyota, broke ground on a new production facility in Kumamoto Prefecture, Japan. The first wafer fabrication plant (Fab 1) of this venture began mass production at the close of 2024. Meanwhile, TSMC has embarked on the construction of Fab 2, with an upgrade in its manufacturing process from the originally intended 6/7nm to the more advanced 3nm technology. While the plant was initially slated to start operations by the end of 2027, there is now a significant possibility that this timeline will be extended to 2028.