Recently, during an earnings briefing, MediaTek made a public confirmation for the first time that it has incorporated Intel's cutting-edge EMIB-T packaging technology into its ASIC projects. Back in late April of this year, MediaTek's CEO, Rick Tsai, disclosed that the company was allocating resources to two distinct packaging solutions in order to cater to the varying requirements of its customers. He specifically mentioned that the technical prowess of the second solution was highly commendable. This latest statement serves as a significant clarification and refinement compared to his previous comments.