TSMC Unveils Plan to Issue NT$18.5 Billion in Bonds, Notably Hiking 5-Year Bond Interest Rate to 2.03%
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Author:小编   

As outlined in the prospectus, TSMC is set to issue the third installment of its unsecured ordinary corporate bonds for the year in July, with a total value of NT$18.5 billion. Specifically, the interest rate for the 5-year bonds has been set at 2.03%, with NT$14 billion earmarked for issuance. Meanwhile, the 10-year bonds will carry an interest rate of 2.10%, with NT$4.5 billion slated for release.