In July 2026, a significant milestone was achieved as the Korea Institute of Industrial Technology and Pohang University of Science and Technology collaboratively announced the successful creation of a cutting-edge chip stacking process. This pioneering method allows for the reliable stacking of more than 10 ultrathin semiconductor chips, with each chip being roughly 14 microns thick (approximately one-fifth the diameter of a human hair). When compared to commercial products, this advancement quadruples the integration density of high-bandwidth memory (HBM), a crucial component in data processing.

This breakthrough is poised to address the memory bottleneck that has long plagued the artificial intelligence sector. By significantly increasing memory capacity and efficiency, it offers vital technical backing for the enhancement of AI chip performance, paving the way for more sophisticated and powerful AI applications. The findings from this groundbreaking research have been duly published in the esteemed Engineering Results journal, marking a significant contribution to the field of semiconductor technology.