As global competition in AI computing power intensifies, bandwidth and energy consumption in data transmission have become critical bottlenecks. To meet the demands of next-generation high-performance computing, TSMC is accelerating the advancement of silicon photonics and co-packaged optics (CPO) technologies. Its COUPE platform employs 3D heterogeneous integration, achieving vertical stacking of optoelectronic chips through hybrid bonding. This reduces signal transmission distances to the micrometer level, cuts power consumption by 40% compared to traditional solutions, improves energy efficiency by fourfold, and supports 6.4Tbps optical engines. NVIDIA's Quantum-X800 and Broadcom's TH6-Davisson switches have already incorporated this technology, reducing power consumption for optical interconnects by 70% and enhancing network energy efficiency by fivefold. 2026 marks the first year of CPO commercialization, with TSMC's COUPE on Substrate architecture set to propel AI optical communications into the industrialization phase.