Hefei Hemei Jingyi Semiconductor Completes New Round of Financing, a Packaging Substrate Manufacturer - Chip

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Hefei Hemei Jingyi Semiconductor Completes New Round of Financing, a Packaging Substrate Manufacturer

2026-07-08 / Read about 0 minute

Author：小编

Recently, Hefei Hemei Jingyi Semiconductor completed a new round of strategic financing, jointly invested by institutions such as Anhui Investment Group.

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