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Maxwell Technologies' Subsidiary Leads National-Level Quantum Chip Flip-Chip Bonding Project
1 day ago /
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Author：小编
Recently, the kick-off meeting for the national key R&D program quantum project, 'Research on Quantum Chip Flip-Chip Bonding Equipment and Key Technologies,' was held at Maxwell Technologies' semiconductor industrial park in the Zhuhai High-Tech Zone. Led by Maxwell Technologies, the project forms a collaborative research consortium with Guangdong University of Technology, Harbin Institute of Technology, and Southern University of Science and Technology. Focusing on superconducting quantum chip flip-chip bonding equipment, the consortium conducts independent R&D, advances prototype development, and performs process validation, marking the comprehensive launch of China's independent efforts in core packaging equipment for quantum chips.
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