Recently, Huagong Tech, a frontrunner in the optical module sector, and Bomin Electronics, a renowned producer of high-end PCBs and ceramic substrates, have entered into a three-year strategic cooperation pact. The collaboration will see both parties delve deep into cooperative efforts within the realms of optical module PCBs and ceramic substrates. This partnership aims to leverage their respective technological strengths and resource advantages, enabling them to collectively seize market opportunities spurred by the escalating demand for AI computing capabilities.
