Scheduled from September 9 to 11, the 2026 International Integrated Circuit Innovation Expo (IICIE) is set to grace the Shenzhen International Convention and Exhibition Center (Bao'an). Under the banner of "Cross-border Integration・Full-chain Collaboration: Co-building a Unique Chip Ecosystem," this expo will coincide with the CIOE China International Optoelectronic Exposition and the elexcon Shenzhen International Electronics Show. Together, these three exhibitions will span an impressive 340,000 square meters, bringing together over 5,000 exhibiting companies and drawing an anticipated crowd of more than 240,000 industry professionals. The expo will offer a comprehensive showcase of the entire integrated circuit industry chain, encompassing chip design, wafer fabrication, packaging and testing, core equipment, key materials, and core components. Additionally, it will feature dedicated exhibition zones, such as the RISC-V ecosystem and AI+ smart sensors. Concurrently, over 20 professional forums will be held, delving into trending topics like automotive chips, semiconductor manufacturing, and advanced packaging technologies.