On June 26, Morgan Stanley released a research report stating that by 2027, AMD's EPYC Venice processor production is expected to reach 6.75 million units, surpassing NVIDIA's Vera processors at 5.75 million units by approximately 17%. In terms of foundry services, TSMC's CoWoS packaging capacity is projected to increase to 200,000 wafers per month by 2027, with NVIDIA remaining its largest customer for advanced packaging.
