Galaxy Securities' mid-term outlook for the electronics sector in 2026 underscores a pivotal trend: the explosive expansion in AI computing infrastructure is propelling the storage market into a sustained phase of price escalation, accompanied by a steady increase in the allocation ratio of HBM wafers. With the imminent introduction of NVIDIA's next-generation Rubin Ultra platform, the HBM capacity per GPU is set to surge to 384GB. This development, coupled with the consistent growth in shipments of AI ASICs, is expected to further amplify the demand for HBM. TrendForce projects that the proportion of HBM wafers within the total DRAM wafer output will ascend from 18% in 2025 to roughly 30% by 2027, while the share of bit supply will also expand from 8% to approximately 13%. Moreover, the rapid advancement of edge AI technology has positioned 3D stacked DRAM solutions as a critical technological avenue for overcoming traditional storage limitations.