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Samsung Mulls Over Constructing a State-of-the-Art Chip Packaging Facility to Cater to Worldwide Chip Requirements
1 day ago /
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Author：小编
On June 10, news emerged that Samsung Electronics is contemplating the establishment of a cutting-edge semiconductor packaging plant in Gwangju, South Korea, with the aim of fulfilling the escalating global demand for chips. In tandem with this move, Samsung is also bolstering its foothold in the High Bandwidth Memory (HBM) market, thereby solidifying its stance within the AI chip supply chain. Anticipation is high that Samsung will unveil its investment blueprint during the meeting scheduled between the South Korean President and the leaders of business conglomerates on June 29.
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