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Samsung Considers Building New Advanced Chip Packaging Plant to Meet Global Chip Demand
1 day ago /
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Author：小编
Samsung Electronics plans to construct an advanced semiconductor packaging plant in Gwangju, South Korea, to meet global chip demand and strengthen its position in the AI chip supply chain. It is expected that Samsung will announce this investment plan at the meeting between the South Korean President and heads of business conglomerates on June 29. Currently, Samsung is actively expanding its market presence in HBM, with its customers already including major AI companies such as NVIDIA, AMD, and Google.
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