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AAC Technologies' MEMS heat dissipation chip enters trial production, with mass production expected in early 2027
8 hour ago /
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Author：小编
Recently, AAC Technologies announced that its CoolFan series of active heat dissipation chips, based on key MEMS piezoelectric thin-film technology, have completed research and development trials and entered the small-batch trial production stage, with mass production and shipment expected in early 2027. This product addresses the heat dissipation pain points of end-side AI terminals, providing efficient heat dissipation solutions for devices such as AI smartphones, smartwatches, and XR glasses, meeting the industry's demand for miniaturized, low-noise, and low-power active heat dissipation solutions.
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