On May 29, Guangzhou unveiled the blueprint of its 15th Five-Year Plan for National Economic and Social Development, outlining a strategic vision to propel the semiconductor and integrated circuit industry forward. The plan emphasizes accelerating advancements in specialized process chip manufacturing, automotive-grade chip design, advanced packaging technologies, and third-generation semiconductors. It also aims to pave the way for a new avenue in high-end digital chips, with the ambition of establishing a pivotal hub for the ‘third pole’ of national integrated circuit industry development.

Concurrently, the plan calls for expediting the construction of major projects, such as the fourth phase of the CANSEM initiative. It supports Huangpu District in its efforts to attract and nurture high-end chip design firms, key material and equipment suppliers, as well as advanced packaging and testing enterprises, thereby fostering a robust analog chip industry chain. Zengcheng District is encouraged to focus on the development of intelligent sensors and specialized process chip manufacturing. Additionally, Nansha District is poised to create a cluster of wide-bandgap semiconductor industry chains, further solidifying Guangzhou’s position as a leader in the semiconductor and integrated circuit sector.