On May 27, data from the Shanghai Stock Exchange revealed that ChangXin Technology, a prominent domestic memory chip manufacturer, successfully cleared the review process for its Initial Public Offering (IPO) on the Science and Technology Innovation Board. Prior to this, on May 19, Yangtze Memory, a leader in the domestic flash memory sector, entered the IPO preparation phase (Note: Here, 'IPO Tutoring period' is refined to 'IPO preparation phase' to align with standard financial terminology). According to projections by the International Semiconductor Industry Association, the global memory market value is anticipated to exceed US$550 billion by 2026, establishing itself as a pivotal growth sector within the semiconductor industry.

The explosive expansion of the memory industry is primarily attributed to a significant uptick in demand for AI computing power. The exponential increase in the parameter scale of AI large models has substantially elevated the need for memory capacity and bandwidth. Experts highlight that AI development is currently hindered by chip limitations in the short term and energy constraints in the long term, with memory bottlenecks expected to remain a persistent issue. Presently, the demand for DRAM per AI server is 8-10 times greater than that of traditional servers. Moreover, high-end memory solutions like High Bandwidth Memory (HBM) are experiencing a supply shortage, with the gap between supply and demand projected to persist until at least the end of 2027. Memory has thus emerged as a critical bottleneck in AI computing infrastructure, and advancements in its technological iteration and capacity expansion will directly influence the pace of development in the AI industry.