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Samsung Initiates Sample Shipments of HBM4E Chips to International Clients, Boasting Over 20% Performance Enhancement Compared to HBM4
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Author：小编
On May 29, Samsung Electronics revealed that it has commenced the delivery of samples for the industry's pioneering 12-layer HBM4E high-bandwidth memory chips to key global clients. This chip boasts a capacity of 48GB, marking a more than 30% increase from its predecessor, along with performance enhancements surpassing 20%. The memory bandwidth for a single stack reaches an impressive 3.6TB/s, energy efficiency is enhanced by 16%, and thermal resistance is reduced by over 14%. Samsung intends to roll out 8-layer 32GB and 16-layer 64GB variants in the future, tailored to customer requirements. At present, Samsung's main HBM4E clientele comprises leading AI firms such as AMD, NVIDIA, and Google.
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