On May 28, NVIDIA's CEO, Huang Renxun, granted an interview following an exclusive dinner in Taipei. The discussion spanned a range of topics, including the fierce competition within the AI sector and the trend of cloud service providers venturing into chip development. When queried about Huawei Semiconductor's 'Tao (τ) Law' and its 'Logic Folding' technology, Huang Renxun remarked that this signifies a substantial technological advancement for Huawei. Nevertheless, he emphasized that it does not constitute a threat to TSMC. He explained that through the application of chip stacking and 3D packaging techniques, Huawei has managed to exponentially increase the transistor count—doubling, tripling, or even quadrupling it—without necessitating a reduction in the semiconductor process linewidth. However, it's worth noting that TSMC has already been honing its expertise in this particular domain for close to a decade.