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Recently, the principal structure of TSMC's third wafer fabrication plant (fab) in Phoenix, Arizona, USA, has successfully undergone roof sealing. This state-of-the-art fab is set to introduce a cutting-edge 2nm-class node process, boasting advanced N2/A16 process wafer foundry capabilities. It is strategically positioned to commence mass production by the end of this decade.
In the project's timeline, the first wafer fab has already initiated mass production, marking a significant achievement. Meanwhile, the second fab is on track, with equipment relocation anticipated during the latter half of this year. Mass production at the second fab is slated to begin in the second half of 2027, further solidifying TSMC's presence and production capacity in the region.
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