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With the burgeoning demand for AI packaging and testing services, companies specializing in these areas are stepping up their investment and broadening their production capabilities. Nevertheless, the unexpectedly robust demand for sophisticated packaging and testing equipment has triggered a surge in orders, resulting in bottlenecks within the upstream supply chain and a consequent crowding-out effect on production capacity. Delivery times for certain equipment have now ballooned to over a year, compelling delays in the rollout of new production capacities. Take Powertech Technology as an example: the company initially intended to boost its capacity by 6,000 wafers in 2026 but has revised its plan to launch 3,000 wafers initially, followed by an additional 3,000 wafers in 2027.
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