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On February 26th, Harish Balladewaja, Vice President of Product Marketing at Broadcom (AVGO.O), revealed on Wednesday that the company expects to sell at least 1 million chips by 2027, leveraging its stacked design technology. This forecast is based on Broadcom's newly launched products and sales targets, with the potential to generate billions of dollars in revenue for the company. Broadcom's stacking technology enhances data transmission speed by stacking two chips and closely connecting different silicon wafers. Balladewaja stated that this technology enables customers to produce chips with stronger performance and lower energy consumption, meeting the rapidly growing computational demands of artificial intelligence software. He noted that nearly all customers have already begun adopting this technology.
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