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Minde Electronics: Intends to Secure Up to 1 Billion Yuan via Private Share Placement for Key Projects, Including Specialized High-Voltage Power Semiconductor Devices and Power Integrated Circuit Wafe
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Author：小编
On February 26, Minde Electronics unveiled its strategy to raise a maximum of 1 billion yuan through a private placement of A-shares. The funds will be earmarked for pivotal projects, notably the development of specialized high-voltage power semiconductor devices and the establishment of a power integrated circuit wafer foundry. Additionally, a portion of the proceeds will be utilized to bolster the company's working capital. Once these projects are fully operational, they are projected to augment the monthly production capacity by 60,000 wafers, thereby significantly strengthening Minde Electronics' competitive edge in the market.
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