On January 8, the General Office of the Guangzhou Municipal People's Government unveiled a strategic plan. This plan aims to consistently bolster the design, manufacturing, as well as packaging and testing capabilities for a diverse range of automotive chips. These encompass computing, control, memory, analog driving, and power supply chips, along with communication and interface chips, sensor chips, and power chips. The objective is to elevate the security standards of the industrial and supply chains.

Moreover, the plan underscores the importance of fostering collaboration between chip manufacturing and design firms and automotive manufacturers. The focus is on carrying out packaging, testing, and certification applications for an array of highly reliable chips, such as microcontroller units (MCUs), artificial intelligence chips, power control management chips, advanced driver assistance system (ADAS) chips, automotive audio and video chips, and information terminal chips. By doing so, it will expedite the enhancement of relevant supporting service capabilities and propel the large-scale utilization of independently controllable automotive chips.