On January 4, 2026, Hangzhou Silan Microelectronics orchestrated a grand ceremony in Haicang District, Xiamen City. During the event, the company officially declared the commencement of operations for its 8-inch silicon carbide (SiC) power device chip manufacturing production line. Simultaneously, it marked the groundbreaking of its 12-inch high-end analog integrated circuit chip manufacturing production line project.

The 8-inch production line represents a massive investment of 12 billion yuan and will be developed in two distinct phases. Once fully operational, it is projected to churn out 720,000 8-inch SiC chips on an annual basis. Following the completion of the initial phase, it will boast an annual production capacity of 420,000 8-inch SiC power device chips, catering predominantly to sectors like new energy electric vehicles and photovoltaics.

The 12-inch production line, on the other hand, is earmarked for an investment of 20 billion yuan and will also undergo construction in two phases. Upon reaching full capacity, it is anticipated to produce 540,000 12-inch high-end analog integrated circuit chips each year, with a keen focus on high-end applications such as automotive and large-scale computing servers.