As scheduled for the fourth quarter of 2025, TSMC has officially launched mass production of its 2nm (N2) process chips. While there wasn't a formal launch ceremony, the company's official website's technical page has verified this advancement. This cutting-edge technology incorporates first-generation GAA (Gate-All-Around) nanosheet transistors. By employing a full-surround gate structure, it enhances electrostatic control and minimizes leakage rates. At the same power consumption level, this technology can boost performance by 10% - 15%. Alternatively, when maintaining the same performance, it can slash power consumption by 25% - 30%. Additionally, it leads to a 15% increase in transistor density (with pure logic circuit designs seeing an increase of up to 20%). In the early stages of mass production, Fab 22 in Kaohsiung will take the lead, with Fab 20 in Hsinchu joining in later. In 2026, production capacity will experience a swift expansion to cater to the surging demand for high-end mobile phone chips and AI/HPC processors from clients like Apple, NVIDIA, and AMD. As derivatives of the N2 family, the N2P process (optimized for both performance and power efficiency) and the A16 process, which incorporates Backside Power Rail technology, are slated for mass production in the latter half of 2026. This will further cement TSMC's dominant position in advanced process technologies.