Samsung Electronics' wafer fabrication plant in Taylor, Texas, is stepping up its efforts to deploy cutting - edge manufacturing processes. It is making the leap from 4nm to 2nm technology. At present, the facility has issued orders for semiconductor manufacturing equipment that is compatible with the 2nm process. The first set of equipment is projected to arrive in March 2026, and manufacturing operations are anticipated to kick off as early as the second quarter of that year. The plant has set its sights on achieving large - scale mass production by 2027. Regarding production capacity, the initial goal has been elevated from 20,000 wafers per month (WPM) to 50,000 WPM. Moreover, there are plans to ramp up the capacity to 100,000 WPM by 2027. This strategic move is aimed at going head - to - head with TSMC for advanced process orders and luring U.S. customers by capitalizing on its production capacity edge.