According to relevant reports, Intel's Fab 52 plant in Arizona has outperformed TSMC's facility in the same state, excelling in both technological sophistication and production capacity. Fab 52 is purpose - built for the 18A process (belonging to the 1.8 - nanometer class). It boasts a full - load monthly production capacity of approximately 40,000 wafers, which is a substantial lead over TSMC's single - factory monthly capacity of around 20,000 wafers. However, given the exceedingly high technical complexity of the 18A process, the current yields are still in the process of ramping up. In the United States, where the semiconductor industry is highly competitive, Intel has formulated a strategic plan. It intends to enhance yields through continuous refinement of the manufacturing process. Moreover, the company will gradually expand its production capacity. By doing so, Intel aims to reshape the competitive landscape of the U.S. chip manufacturing sector.